Microwave and Millimeter-Wave Electronic PackagingArtech House, 2013 M12 1 - 261 páginas Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs. |
Contenido
1 Introduction | 1 |
2 Materials | 39 |
3 Ceramic Packaging | 67 |
4 Laminate Packaging | 91 |
5 FirstLevel Interconnects | 107 |
6 SecondLevel Interconnects | 143 |
7 Modules and Motherboards | 161 |
8 Transitions and 3D Packaging | 181 |
10 Electromagnetic Modeling | 219 |
11 Conclusions and Future Horizons | 233 |
Appendix A | 241 |
Appendix B | 245 |
Appendix C | 249 |
About the Author | 251 |
| 253 | |
9 Heat Transfer | 201 |
Términos y frases comunes
alumina amplifier analysis antenna applications bond pad bump calculated capacitance capacitor catch pad cavity CBCPW coplanar waveguide copper cost coupling developed dielectric constant dielectric material effective dielectric constant electric field electromagnetic electronic packaging equation equivalent circuit fabricated film flip chip flip chip interconnects Frequency GHz function ground plane heat transfer HTCC IEEE MTT-S International IEEE Trans inductance insertion loss integrated circuit International Microwave Symposium junction temperature laminate circuit board layers line impedance line width loss tangent lower frequencies LTCC measured metal method microstrip line microwave and millimeter-wave Microwave Symposium Digest Microwave Theory millimeter-wave frequencies MMIC module motherboard MTT-S International Microwave parasitic effects plate Port propagation QFN package resistors return loss scattering parameters shown in Figure shows solder stripline substrate substrate thickness Theory and Techniques thermal conductivity thick-film thin-film transition transmission line undesired vias voltage wave waveguide wire bond